Tshaj Copper: Yuav Ua Li Cas Thermal Conductivity Pob Zeb Diamond Ua kom nrawm dua thiab ntseeg tau ntau dua semiconductor txias
Jul 31, 2026| 
Cov tooj liab ntshiab tau siv los ua cov khoom siv hluav taws xob hluav taws xob hluav taws xob rau ntau xyoo lawm, nrog rau cov thermal conductivity ntawm kwv yees li 400 W / m·K. Nyob rau hauv lub sijhawm tam sim no uas AI GPUs tshaj 1000W thiab SiC / GaN fais fab modules muaj qhov kub ntawm qhov ceev ntawm ntau tshaj 1000 W / cm², lub cev txwv ntawm tooj liab tau mus txog: hotspots tsis tuaj yeem nthuav tawm sai sai, nti hlws ris kub nce, ua rau txo qis, thiab 10℃nce rau 5% txo qis. Lub pob kuj warps thiab detaches vim qhov tsis sib haum xeeb hauv CTE (16.7 ppm / degree) nrog silicon (2.6) / SiC.
High thermal conductivity hluavtaws pob zeb diamond(polycrystalline CVD 1500–2000 W/m·K, ib leeg siv lead ua IIa 2200–2400 W/m·K) yog 5–5.5 npaug ntawm tooj liab, nrog CTE ntawm tsuas yog 1–2 ppm / degree, ua tiav zero thermal mismatch nrog lub nti; Nws kuj yog ib qho hluav taws xob insulator, tso cai rau kev txuas ncaj qha ntawm liab qab tuag, thiab tuaj yeem tiv taus 1200℃thiab qhov ceev ntawm 3.5 g / cm³ (tooj liab 9). Lub CVD pob zeb diamond kub dab dej txo cov GPU hlws ris kub los ntawm 15-25 degree, tso tawm 10-22% ntawm lub tshuab xam zauv; lub pob zeb diamond{16}} tooj liab sib xyaw (Pob zeb / Cu, 40–60% ntim feem) ua tiav 600–1000 W / m·K, ntsuas tus nqi thiab kev tsim khoom, thiab tau dhau los ua lub zog tsim khoom tseem ceeb rau AI servers thiab automotive- qib SiC inverters.
Kev txiav txim siab yuav khoom: Nws tsis yog hais txog "txawm yuav hloov lossis tsis", tab sis "yuav ua li cas teeb tsa".
Flagship HPC/RF GaN: Ib leeg siv lead ua/multi-crystal CVD pob zeb diamond kub dab dej + Ti/Pt/Au metallization, ze rau -hluav taws kub dissipation;
Mainstream AI servers/automotive-qib hwj chim: Pob zeb diamond/Cu composite substrate, CTE kho kom haum SiC;
Lub tshuab nqus tsev thiab cov nqa khoom: Tungsten tooj liab, molybdenum tooj liab rau cov khoom siv hluav taws xob, titanium alloy rau cov tuav wafer thiab cov khoom siv lub tshuab nqus tsev.
Cov pitfalls ntawm decentralized procurement yog heev pov thawj: Lub hwj chim semiconductor Hoobkas cais yuav CVD pob zeb diamond, tungsten tooj liab substrate, thiab TC4 cab kuj. Lub sij hawm xa tuaj ntawm peb yog 2 lub lis piam sib nrug. Lub metalization ntawm pob zeb diamond nto tsis tau raws li cov qauv, uas ua rau voids nyob rau hauv AuSn soldering, thiab tag nrho batch raug muab pov tseg. Lwm lub Hoobkas yuav cov tooj liab ntshiab IHS thiab outsourced pob zeb diamond composite. Lub interface thermal tsis kam tshaj tus qauv, thiab cov chips tseem muaj kev txo qis zaus.
Ib - nres kev daws teeb meem los ntawmTuam Tshoj Super Tech Co., Ltd.
Peb tau tsim nyob rau hauv Beijing xyoo 2013. Peb muaj peb tus kheej tag nrho - txheej txheem Hoobkas rau hmoov metallurgy + precision processing + nqus cua sov kho, tsis muaj outsourcing lossis luam markups. Peb cov nqi yog 20-40% qis dua cov neeg muag khoom nyob sab Europe thiab Asmeskas rau tib qhov tshwj xeeb. Peb xa tawm mus rau ntau tshaj 30 lub teb chaws.
Cov khoom lag luam thiab cov khoom lag luam:
Artificial pob zeb diamond: CVD polycrystalline / ib leeg siv lead ua cua sov dab dej, Pob zeb diamond / Cu composite los xij, muaj pob zeb diamond micro{0}} hmoov, nrog qib ruaj khov siv lead ua thiab ± 1% concentration tswj, batch variation <3%;
Cov hlau tawv: tungsten hlau / tungsten- tooj liab, molybdenum ntawv (99.95%) / molybdenum tooj liab, tantalum- niobium phaj hlau (Nb ua cov khoom seem <2%);
Titanium alloys: Gr1/2/5/7/9/12/23, TC4, Ti-6Al-4V ELI, tag nrho specifications rau rods, daim hlau, hlab, flanges, ASTM / ASME / DIN / JIS;
Tsib -axis CNC precision qhov chaw: semiconductor nqa, lub tshuab nqus tsev titanium qhov chaw, kho mob titanium alloys.
📩sales@moly-tungsten.com ｜ +86 13436334453 ｜ https://www.moly-tungsten.com/
FAQ
Q1: Puas yog CVD pob zeb diamond hluav taws xob hluav taws xob tsim nyog hloov tooj liab rau AI / HPC txias?
Yes when power >700W or hotspot >500W / cm²: CVD pob zeb diamond txiav hlws ris temp 15-25 degree, tshem tawm tooj liab CTE mismatch warping, pab txhawb kev txhawb nqa. Rau nruab nrab-hwj chim, Pob zeb diamond/Cu composite (600–1000 W/m·K) yog tus nqi- kev xaiv sib npaug.
Q2: Ib tus neeg muag khoom puas tuaj yeem xa cov pob zeb diamond + W / Mo / Ti semiconductor qhov zoo sib xws?
Yog- ntsug- cov tuam txhab koom ua ke xws li Tuam Tshoj Super Tech tswj CVD pob zeb diamond, W-Cu/Mo-Cu, Ti Qib 5 CNC, lub tshuab nqus tsev kho cua sov thiab NDT hauv- tsev, muab ib MTC/CoA, ib lub koom haum lav, 30–40% luv luv sij hawm coj mus kuaj vs ven ntau{8}.