video

Molybdenum Copper Heat Sink

Lub molybdenum- tooj liab (Mo-Cu) lub dab dej kub yog cov hlau- cov khoom siv ua kom txias txias tshwj xeeb uas tsim los rau siab - lub zog hluav taws xob hluav taws xob. Nws tsis yog ib qho yooj yim hlau alloy; xwb, nws yog tsim los ntawm hmoov metallurgy, qhov twg molybdenum (Mo) thiab tooj liab (Cu) yog microscopically ua ke los tsim ib tug tshwj xeeb "molybdenum molybdenum molybdenum - tooj liab filling" qauv. Cov qauv no ingeniously sib txuas cov thermal expansion coefficient qis ntawm molybdenum, siab - qhov kub thiab txias stability, thiab zoo heev thermal thiab hluav taws xob conductivity ntawm tooj liab, zoo daws qhov tsis sib xws ntawm tshav kub dissipation thiab thermal stress ntawm siab - fais fab chips.

  • Khoom Taw qhia

Molybdenum Copper Heat Sink

 

Lub molybdenum- tooj liab (Mo-Cu) lub dab dej kub yog cov hlau- cov khoom siv ua kom txias txias tshwj xeeb uas tsim los rau siab - lub zog hluav taws xob hluav taws xob. Nws tsis yog ib qho yooj yim hlau alloy; xwb, nws yog tsim los ntawm hmoov metallurgy, qhov twg molybdenum (Mo) thiab tooj liab (Cu) yog microscopically ua ke los tsim ib tug tshwj xeeb "molybdenum molybdenum molybdenum - tooj liab filling" qauv. Cov qauv no ingeniously sib txuas cov thermal expansion coefficient qis ntawm molybdenum, siab - qhov kub thiab txias stability, thiab zoo heev thermal thiab hluav taws xob conductivity ntawm tooj liab, zoo daws qhov tsis sib xws ntawm tshav kub dissipation thiab thermal stress ntawm siab - fais fab chips.

 

Khoom nta

 

1.Adjustable thermal expansion coefficient

Qhov tseem ceeb tshaj plaws ntawm MoCu Heat Sink, nyob hauv lawv cov thermal expansion coefficient. Los ntawm kev hloov qhov piv ntawm molybdenum thiab tooj liab, thermal expansion coefficient (CTE) tuaj yeem tswj tau qhov tseeb, ua kom muaj kev sib raug zoo thermal nrog ceramic substrates (xws li Al₂O₃, BeO) lossis semiconductor chips (xws li Si, GaAs, GaN). Kev ua tau zoo ntawm molybdenum- tooj liab kub dab dej nrog qhov sib txawv sib txawv. Piv txwv li, Mo70Cu lub dab dej kub nrog cov ntsiab lus molybdenum ntawm 70 ± 1 wt% muaj qhov ceev ntawm kwv yees li 9.8 g / cm³ thiab thermal expansion coefficient ntawm 9.1 ppm / K, nrog rau thermal conductivity xws li 170 - 200 W/m·K; Mo60Cu lub dab dej kub nrog cov ntsiab lus molybdenum ntawm 60 ± 1 wt% muaj qhov ceev ntawm kwv yees li 9.66 g / cm³ thiab thermal expansion coefficient ntawm 10.3 ppm / K, nrog rau thermal conductivity xws li 210 - 250 W / m·K, thiab lwm yam.

 

2.High thermal conductivity

Hauv molybdenum-tooj cua kub dab dej, cov tooj liab tsim cov qauv txuas txuas ntxiv, muab txoj hauv kev ua kom sov sai. Nws cov thermal conductivity yog ntau dua li cov khoom siv semiconductor ib txwm, ua rau kom muaj kev sib txawv sai ntawm cov cua sov uas tsim los ntawm cov hotspots hauv zos mus rau tag nrho cov substrate, txhim kho cov cua sov kom zoo.

 

3.Excellent siab -kub kuj thiab kev ntseeg tau

Lub siab melting point ntawm molybdenum ua rau molybdenum tooj liab cua sov dab dej kom muaj kev ruaj ntseg thiab txhua yam muaj zog nyob rau hauv siab - qhov kub thiab txias ib puag ncig, uas yog ib qho tseem ceeb rau cov cuab yeej ua hauj lwm nyob rau hauv hnyav tej yam kev mob (xws li nyob rau hauv aerospace). Tsis tas li ntawd, nws cov hardness siab thiab hnav tsis kam ua kom muaj kev ntseeg siab thaum lub sijhawm ntim khoom thiab siv sijhawm ntev -.

 

4.Qhov hnyav txo kom zoo dua

Piv nrog tungsten- tooj liab (W-Cu) cov khoom siv hluav taws xob nrog cov kev ua haujlwm zoo sib xws, molybdenum- tooj liab cua sov dab dej muaj qhov ntom ntom uas yog kwv yees li 40% qis dua. Hauv thaj chaw xws li aerospace, satellite kev sib txuas lus, thiab microwave ntim qhov twg qhov hnyav rhiab heev yog qhov kev txhawj xeeb, molybdenum- tooj liab cua sov dab dej muaj qhov zoo, pab txo qhov hnyav tag nrho ntawm cov cuab yeej thiab txhim kho cov cuab yeej ua haujlwm.

 

product-1070-599

 

Daim ntawv thov

 

1.High-cov khoom siv hluav taws xob semiconductor

Molybdenum-copper heat sinks (MoCu heat sinks) yog dav siv los ua cov dab dej kub thiab cov thermal bases rau insulated gate bipolar transistors (IGBTs), siab -power LEDs, xov tooj cua zaus (RF) thiab microwave hwj chim raj. Lawv tuaj yeem txo qhov kub ntawm qhov sib txuas, ua kom lub neej ntev ntawm lub cuab yeej, thiab ua kom ruaj khov ua haujlwm ntawm siab -cov khoom siv hluav taws xob semiconductor.

 

2.Aerospace thiab Defense

Hauv kev tswj xyuas thermal ntawm cov tshuab xws li cov cuab yeej siv hluav taws xob hauv lub dav hlau, cov kav hlau txais xov sib txuas lus satellite, thiab cov huab cua hauv theem array radars, molybdenum- tooj liab cua sov dab dej ua lub luag haujlwm tseem ceeb. Lawv lub teeb yuag, kev ntseeg siab, thiab sib piv cov yam ntxwv thermal expansion nrog cov chips ua rau lawv cov khoom siv thermal tswj tsis tau hauv cov teb no, ua kom muaj kev ua haujlwm zoo ntawm cov cuab yeej hauv ib puag ncig nyuaj.

 

3.Advanced Ntim thiab Microelectronics

Hauv 3D ntim thiab lub kaw lus-hauv- pob (SiP), molybdenum- tooj liab cua sov dab dej tuaj yeem ua cov pob npog, interposers, lossis nti mounting substrates, muab kev txhawb nqa txhua yam thiab thermal conduction txoj hauv kev rau cov chips stacked. Raws li kev sib koom ua ke ntawm cov chips txuas ntxiv nce ntxiv, ncaj qha kev tsim molybdenum- tooj liab cua sov dab dej rau hauv cov qauv hluav taws xob me me (xws li microchannels) tau dhau los ua kev txiav - kev tshawb fawb ntug.

 

4.Chip-theem microchannel txias

Cov kev tshawb fawb tshiab tshaj plaws yog siv cov molybdenum- tooj liab kub dab dej nws tus kheej ua lub cev tseem ceeb ntawm microchannel txias. Vim nws cov thermal expansion txuam nrog cov nti, micro- millimeter- cov kab me me tuaj yeem ua ncaj qha rau ntawm lub dab dej kub, tso cai rau cov kua dej txias (xws li dej deionized) ntws mus rau thaj tsam ntawm cov nti rau kev sib pauv cua sov. Cov kev sim tau pom tias qhov "chip proximal cooling" tsim no tuaj yeem txhim kho qhov ua kom txias thiab ua haujlwm zoo nrog cov cua kub kub ntau tshaj 1000 W / cm².

 

product-1067-604

 

Specification

 

Parameter

Specification / Ntau

Hom khoom

Molybdenum Copper Heat Sink

Kev tsim khoom

Hmoov Metallurgy / Copper Infiltration

Cov ntsiab lus (Cu)

10% - 30% (customizable)

Cov Qib Siab

Mo70Cu30/Mo80Cu20/Mo90Cu10

Qhov ntom

9.4-9.8g / cm³

Thermal conductivity

160 – 220 W/m·K

Coefficient ntawm Thermal Expansion (CTE)

6.5 - 8.5 × 10⁻⁶ / K (25-300 degree)

Hluav taws xob conductivity

Ntau dua lossis sib npaug li 30% IACS

Tshwj xeeb kub

~ 250 J/kg · K

Ua haujlwm kub

Txog li 500℃+

Melting Point

>2600℃(Mo matrix)

Hardness

150-220 HB

Nto tiav

Polished / Av / Machined

Nto Roughness

Ra 0.8 - 3.2 μm (customizable)

Txheej txheej xaiv

Ni / Au / Ag plating muaj

Dimensional kam rau ua

± 0.01 hli (precision machining muaj)

Muaj Cov Qauv

Phaj / Sheet / Thaiv / Flange / Custom Parts

Standard Sizes

Customized ib daim duab

Kev Koom Tes

Brazing / Soldering / Mechanical fastening

Ntim

Nqus ntim / Export txheem ntoo rooj plaub

 

Customized Service

 

product-1267-713

Molybdenum tooj liab cua kub dab dej feem ntau yog tsim los ntawm cov hmoov hlau metallurgy thiab fusion infiltration txoj kev, ua rau cov khoom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom.

Nws muaj cov khoom ua haujlwm zoo heev thiab tuaj yeem ua tiav rau hauv cov ntawv nyias nyias lossis cov qauv tsim los ntawm kev txiav, laser ua, kub dov thiab lwm yam txuj ci raws li cov neeg siv khoom sib txawv.

Nyob rau tib lub sijhawm, peb tuaj yeem ua cov kev kho mob saum npoo xws li npib tsib xee plating thiab kub plating raws li cov neeg siv khoom thov los txhim kho cov weldability thiab corrosion kuj ntawm lawv, ua tau raws li ntau hom kev thov.

Yog tias koj muaj qee qhov kev hloov kho rau peb cov molybdenum- tooj liab kub dab dej, thov koj xav tiv tauj peb txhua lub sijhawm.

product-1267-713

 

FAQ

 

1. Molybdenum Copper Heat Sink yog dab tsi?

Nws yog cov khoom sib xyaw ua ke los ntawm kev sib xyaw molybdenum thiab tooj liab, feem ntau los ntawm cov txheej txheem infiltration. Nws muaj cov thermal conductivity thiab tswj thermal expansion, ua rau nws zoo tagnrho rau kev siv hluav taws xob cua txias.

2. Vim li cas MoCu zoo dua li cov tooj liab ntshiab lossis txhuas cov cua sov?

MoCu muab qhov tshwj xeeb sib npaug ntawm cov cua kub dissipation (los ntawm tooj liab) thiab qis thermal expansion (los ntawm molybdenum), txo cov thermal stress thiab txhim kho kev ntseeg tau. Tsis zoo li txhuas, nws tswj kev ua haujlwm txawm tias kub kub.

3. Dab tsi yog cov ntawv thov tseem ceeb ntawm MoCu cua sov dab dej?

Lawv yog dav siv nyob rau hauv:
Fais fab Electronics (IGBT, MOSFET)
RF thiab microwave cov khoom siv
Laser diodes thiab LED modules
Aerospace thiab satellite systems
Cov ntawv thov no xav tau kev hloov hluav taws xob zoo thiab qhov ruaj khov.
4. Cov thermal expansion (CTE) ntawm MoCu puas tuaj yeem hloov kho?
Yog lawm. CTE ntawm MoCu tuaj yeem hloov kho los ntawm kev hloov cov tooj liab - mus rau - molybdenum piv, tso cai rau nws kom phim cov ntaub ntawv xws li silicon, ceramics, thiab GaAs.

5. Dab tsi yog qhov sib xyaw ua ke ntawm MoCu cov ntaub ntawv?

Common compositions muaj xws li:
m70cu 30
Mo80Cu20
m90cu10
Cov ntsiab lus tooj liab siab dua ua rau cov thermal conductivity, thaum molybdenum siab dua txhim kho qhov ruaj khov.

6. Puas yog MoCu haum rau qhov kub siab - ib puag ncig?

Yog lawm. MoCu ua tau zoo nyob rau hauv siab - qhov kub thiab txias ib puag ncig vim molybdenum lub siab melting point (~ 2620 degree) thiab nws muaj peev xwm khaws cia thermal kev ua tau zoo dua aluminium ntawm qhov kub siab.

7. Puas yog MoCu muaj kev ua haujlwm zoo thiab muaj peev xwm plating?

Yog lawm. MoCu muaj kev ua haujlwm zoo thiab tuaj yeem ua tiav nrog cov ntaub ntawv xws li npib tsib xee (Ni), kub (Au), lossis nyiaj (Ag) txhawm rau txhim kho cov khoom siv thiab kev tiv thaiv corrosion.

8. MoCu piv rau tungsten tooj liab (WCu) li cas?

MoCu feem ntau sib dua thiab tus nqi ntau dua - ua haujlwm zoo dua WCu, thaum tseem muab cov khoom siv hluav taws xob zoo thiab cov khoom siv kho tshuab, ua rau nws tsim nyog rau kev ntim khoom siv dav hlau thiab hluav taws xob.

9. Puas yog MoCu tau txais cov khoom siv semiconductor?

Yog lawm. Nws kho tau CTE tso cai rau nws kom sib haum nrog cov khoom siv semiconductor zoo li Si thiab GaAs, txo cov kev ntxhov siab sab hauv thiab txhim kho cov cuab yeej lifespan.

10. Dab tsi yog qhov zoo ntawm MoCu cua sov dab dej?

High thermal conductivity
Tsawg thiab tunable thermal expansion
Zoo heev -kub kev ua haujlwm
Zoo hermeticity thiab stability
Tsis yog- sib nqus thiab nqus tau

 

Cim npe nrov: Tuam Tshoj molybdenum tooj liab kub dab dej, Tuam Tshoj molybdenum tooj liab kub dab dej manufacturers, lwm tus neeg, Hoobkas

Xa kev nug

(0/10)

clearall